88 Questions About Slkor（7）

 80. What is training process for new employees?

In order to help new employees quickly adapt to job requirements, Slkor provides the following supporting training, including:

1. Company culture and values: Introduce the mission, vision and core values of Slkor, the company's basic ethics, help new employees understand the corporate culture, and practice the company's culture at work.

2. Job responsibilities and work process: Introduce in detail the responsibilities and work content of the new employee's position, including task assignment, work process, work standards, reporting objects, etc. Help new employees adapt to work quickly through clear job responsibilities and process introductions.

3. Knowledge of the company's products or services: For positions related to products or services, the training will involve the company's product or service knowledge, including functional characteristics, usage methods, market competition, etc. Make sure new hires have a solid understanding of the product or service being offered.

4. Professional knowledge and industry trends: For positions in specific industries or fields, the training also includes the introduction of relevant professional knowledge and industry trends, so that new employees can keep up with the development and changes of the industry.

5. Customer relationship and communication skills: The position needs to communicate with internal colleagues, customers or external partners. The training content will include establishing and maintaining good customer relationships, effective communication and problem-solving skills.

6. Teamwork and leadership: The training will emphasize the meaning, methods and skills of teamwork, as well as the understanding and implementation of leadership responsibilities.

81. What are the terminology of semiconductor technology?

1. Deposition: Deposit thin film layers on the surface of semiconductor materials, such as chemical vapor deposition (CVD) and physical vapor deposition (PVD).

2. Etching: Use chemical or physical methods to remove unwanted materials on the surface, such as wet etching and dry etching.

3. Photolithography: Use photoresist and mask to map the pattern onto the chip surface to define the pattern of the circuit.

4. Annealing: Change the lattice structure and properties of materials through the process of heating and cooling.

5. Doping: Introducing impurities into the material to change its electronic properties, such as n-type doping and p-type doping.

6. Metallization: Add a metal layer on the chip for current flow, connection and wiring.

7. Cleaning: Remove impurities and pollutants through chemical solutions or physical processes to maintain the purity of the chip.

8. Alkaline Cleaning: Use alkaline solution to remove organic and inorganic residues on the surface of the material.

9. Contact Exposure: The photoresist is directly contacted with the mask to transfer the pattern.

10. Masking Layer: A chemical or physical layer for protection or selective exposure.

11. Annealing: Relieve stress by heating and cooling, improve the quality of lattice structure and adjust electronic properties.

12. Hetero junction: A structure composed of different materials with different energy band structures and electronic properties.

13. Electron Beam Lithography: Use electron beams to draw patterns for high-resolution lithography.

14. CMP (Chemical Mechanical Polishing): A process for leveling and polishing surfaces through chemical and mechanical action.

82. What frequency crystal oscillator does Slkor have?

We have crystal oscillator of 6MHz, 8MHz, 10MHz, 12MHz, 16MH, 24MHz, 25MHz, 26MHz, 27MHz , 27.12MHz, 30MHz , 32MHz , 38.4MHz, 40MHz

83. What are the professional terms in the semiconductor industry?

1. Chip: refers to an integrated circuit (Integrated Circuit, IC), which is a tiny electronic component composed of a large number of semiconductor devices.

2. Semiconductor: A substance with conductivity properties between conductors and insulators, which is widely used in the manufacture of electronic devices.

3. MOS (Metal-Oxide-Semiconductor): A common integrated circuit structure, including metals, oxides and semiconductors.

4. CMOS (Complementary Metal-Oxide-Semiconductor) is a common low-power, highly integrated integrated circuit technology, often used in microprocessors and memories.

5.FPGA (Field-Programmable Gate Array): a programmable logic chips, which can reconfigure circuit functions according to requirements.

6. ASIC (Application-Specific Integrated Circuit): A custom integrated circuit for a specific application, which is more efficient and consumes less power than a general-purpose processor.

7. SoC (System-on-a-Chip): A design that integrates multiple functional modules into a single chip, such as including processors, memory, peripherals, etc.

8. IC process: refers to the process used in the chip manufacturing process, including deposition, etching, photolithography and other steps.

9. Silicon Wafer: A substrate of semiconductor material used to manufacture chips.

10. Packaging: Packaging the chip into a practical device, such as the shell of the chip, leads, etc.

11. BGA (Ball Grid Array): A common chip packaging technology, a certain number of small balls or pads are soldered to the bottom of the chip.

12. Very Large Scale Integration (VLSI): Refers to the integrated circuit design and manufacturing technology with a very high level of integration.

13. Feature Size: refers to the smallest manufacturing unit in the semiconductor process, usually in nanometers.

14. Parasitic Capacitance: Unexpected capacitance generated in semiconductor devices or circuits.

84. What are the major foreign power IC manufacturers?

Texas Instruments (TI) (TI+NS), Analog Devices (ADI) (ADI+Linear+Maxim), Renesas (Renesas+Intersi), Infineon (acquired IR in 2015), NXP (2015 NXP acquired Freescale), On Semiconductor+Fairchild, Skyworks, STMicroelectronics, MPS US, PI US, Microchip, Dialog US, Navitas US, DIODES etc.

85. What are the major domestic power supply IC manufacturers?

JoulWatt, Silergy, SGMICRO, Xinzhihui (Allwinner), Rockchip, SOUTHCHIP, FM, Sinowealth, Changgong Micro, LOWPOWER, Liqi, DIOO, BPS, Kiwi Instruments, AWINIC, Chipown, Lattice Art, ETA, BCT, SCT, 3Peak, LUMISSIL, INJOINIC, Depp Micro, Yuanwei, Reactor-Micro, CHIPLINK, SILAN, Lingqi, Tianwei, Shengxinwei, MAXIC, Angbao (OB), Jingmao Micro, Grande, Anpai, Shengsheng Micro, TPS, Tuopin Micro, SEAWARD, Nanlin Electronics, MICRONE, Laiyuan Electronics, SHOUDING, CONSONANCE, Corebai, Greenliant, HGSEMI, BL.

86. Can we talk more about Slkor SiC devices?

Slkor SiC devices belongs to the third generation of semiconductors and is currently one of the most advanced materials available. It can achieve high voltage, high current, and high efficiency, making it suitable for applications in industries such as electric vehicle charging stations and other large-scale industrial sectors.

87. What are the main parameters for ESD?

The main parameters for ESD (Electrostatic Discharge) are as follows: Maximum Operating Voltage, Breakdown Voltage, Clamping Voltage, Leakage Current, Junction capacitor, Response Time, Recovery Time etc.

88. How to choose a MOS?

First, you need to consider whether you need a PMOS or NMOS. Then, look at the following key electrical parameters: voltage, current, on-resistance, parasitic capacitance, junction temperature, switching frequency, packaging, etc. Slkor's official website, www.slkoric.com, has a dedicated function for selecting the right components.